Retronix has been providing reballing services to the electronics industry for 30 years, making us experts in reballing processes and applications.
+ More than 100 customers supported
RETRONIX Europe offers the Laser system, which reduces the need for additional remelting and thus cuts costs. This process does not involve any thermal stress during reballing.
Laser reballing is the only BGA rework process that meets the manufacturer’s specifications of a maximum of 3 reflow cycles to which a component can be exposed.
Using a production machine, the BGA beads are applied one by one using a laser. During reballing, the BGA is placed on an X/Y motion table and moved to the bead positions by programmed control.
A short laser pulse heats up the pad and ball for a few milliseconds and places a single prefabricated BGA sphere of the exact size
(preform) on top. The component itself remains at room temperature throughout the process.
The process takes place in a nitrogen atmosphere.
This system provides reproducible technology for optoelectronics, MEM’s, sensors, BGA’s, CLCC’s, CSP’s, FlipChips and much more. With the latest laser technology, this gives Retronix the ability to laser high-melt solder balls (HMP), Sn 63/37, SAC 305 down to 205 microns.
A circular economy is vital if we are to transform the impact of the electronics industry on human health, the environment and biodiversity. It is essentially based on the principles of eliminating waste and pollution, conserving products and materials in use, and regenerating natural systems.
Each sector and organization has its own internal requirements for qualifying repair processes and methods.
That’s why Retronix Europe offers both laser and IPC-certified resurfacing reballing to meet our customers’ needs and requirements.
While laser resurfacing offers non-reflow resurfacing, each process has its own advantages. Reflow reballing is qualified and selected by several high-reliability organizations.