Automotive
This sector has specific issues that they face due to RoHS exemption, harsh environment, vibration and obsolescence. Find out how Retronix can assist you.
Our processes validated by OEMs
At Retronix, we offer a range of services designed to improve the reliability of automotive electronics. Unlike many computer and telecommunications electronics, automotive electronics are subjected to extreme movement, vibration and temperature, which can expose any weakness in the solder joints of a printed circuit board. Often, these problems are undetectable until the electronics are subjected to such stress, and they will easily pass all post-manufacturing tests. ..
THE CRISIS OF COMPONENT SHORTAGES IN THE AUTOMOTIVE INDUSTRY
The global shortage of electronic components is currently a major challenge for many industries. At Retronix Europe, we understand the difficulties you are facing as a result of this situation. That’s why we strive to provide you with the right solutions to cope with the shortage of electronic components and keep your business running smoothly.
The shortage of electronic components may seem insurmountable, but we believe that with the right solutions and a proactive approach, it’s possible to minimize disruption and keep your production running.
WHAT SOLUTIONS CAN RETRONIX EUROPE OFFER TO DEAL WITH THE CRISIS?
At Retronix Europe, we’re in a unique position to help all levels of the automotive supply chain solve their current component sourcing problems.
Whether you’re an OEM, supplier or distributor, our safe and reliable component recovery service can solve your obsolescence problems.
Our wide range of services enables us to offer a complete package for component recovery and reuse.
LCC/QFN SERVICES
This type of device is soldered directly to the printed circuit board, for low-temperature soldering.
However, this can cause problems.
The solder joint between the integrated circuit and the printed circuit board is very thin, and liable to break under the effect of vibrations.
CTE (coefficient of thermal expansion) problems can occur when the IC heats up during operation and the PCB does not.
The two expand at different rates, which can crack weld joints.
POTENTIAL POINTS OF FAILURE
Typical weld joint cracks are caused by fatigue during thermal cycling.
Significant difference in coefficient of thermal expansion and vibration between the ceramic LCC body and the PEC substrate. Solder is a fairly weak alloy that cannot easily withstand cyclic stresses. The number of cycles to failure will be low, resulting in poor in-service reliability.
Cross-section of a fatigue failure showing a crack propagating through the brazing mass. Note the very thin layer of solder under the component.
Laser reblasting (the laser fixes the spheres without a reflow cycle) of high-melting spheres, e.g. 90% lead, embedded copper on LCC pads. This process increases the debonding height of the LCC, as the new spheres do not collapse due to reflow during assembly. Cross-section of the LCC. The dark areas are the HMP spheres. Note the difference in detachment height.
– Mitigates CTE problems by allowing heat to escape under the component.
– Stronger connection thanks to HMP sphere (more flexible metal than thin eutectic solder joint).
– Allows cleaning under the integrated circuit, preventing flux residues from being trapped.
– Welding spheres prevent outgassing and eliminate voids.
